Secure a Quote for Other Part Number, a Lubricants, Adhesives, And Coatings Component

Mfg Part Number : 50-02-1038-0000

Manufacturer : Other

Main Category : Adhesives And Coating

Category : Lubricants, Adhesives, And Coatings

Sub Category : Adhesives, Epoxy, And Resins

Description : Cho-Bond 1038 Silver-Plated Copper Filled Silicone Electrically Conductive Sealant. Parker Chomerics Cho Bond? 1038 Is A One Component, Silver-Plated Copper Filled Sealant Formulated To Serve As Gap Filler For Emi Shielding Or Electrical Grounding.

Welcome to the Request for Quote (RFQ) page for Other part number 50-02-1038-0000, a Cho-Bond 1038 Silver-Plated Copper Filled Silicone Electrically Conductive Sealant. Parker Chomerics Cho Bond? 1038 Is A One Component, Silver-Plated Copper Filled Sealant Formulated To Serve As Gap Filler For Emi Shielding Or Electrical Grounding. product that is currently available for procurement here on Electromechanical Automation. If you are interested in securing pricing information on this Lubricants, Adhesives, And Coatings item, be sure to fill out and submit the form below with essential details like your target price and desired quantity. Our representatives are working diligently to ensure a seamless purchasing process, so you can expect a customized response that matches your specifications within 15 minutes or less.

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Disclaimer: This is a quotation for the goods listed above. This quotation is meant as an estimate and does not reflect a final bill or invoice. All quotations are subject to change until acceptance by ASAP Semiconductor of a binding Purchase Order, and quotations may be withdrawn or revised at the sole discretion of ASAP Semiconductor. This quotation is subject to the ASAP Semiconductor Terms & Conditions available at https://www.asapsemi.com/customer-terms-conditions.aspx .All United States Government and Department of Defense bids are quoted as CAGE code 6RE77 from ASAP Semiconductor’s Anaheim, California facility. Any quotation from ASAP Semiconductor without 6RE77 is void.

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